Senior or Principal Product Manager, Texas Institute for ElectronicsEmbedded

{
  "source": {
    "name": "linkedin",
    "id": "4343690585",
    "url": "https://www.linkedin.com/jobs/view/senior-or-principal-product-manager-texas-institute-for-electronics-at-the-university-of-texas-at-austin-4343690585?_l=en"
  },
  "postedDate": "2026-01-03T08:10:44.156Z",
  "applicationDeadline": null,
  "isActive": true,
  "isExpired": false,
  "matching": {
    "role": {
      "primaryTitle": "Senior Product Manager",
      "titleSynonyms": [
        "Principal Product Manager"
      ],
      "secondaryTitles": [],
      "function": "business_administration_professionals",
      "functionConfidence": "high",
      "roleFamily": "m122_sales_marketing_development_managers",
      "roleFamilyConfidence": "medium",
      "roleSubFamily": null,
      "roleSubFamilyConfidence": "unknown",
      "seniority": "senior",
      "industries": [
        "i68_higher_education"
      ]
    },
    "primarySignals": {
      "tasks": [
        "Drive product strategy and roadmap for advanced 2.5D/3D microsystems integration platforms",
        "Align engineering execution with market needs and business objectives",
        "Author and maintain Product Requirements Documents (PRDs)",
        "Drive cross-functional collaboration across packaging R&D, process engineering, design automation, and product marketing",
        "Engage with customers and industry partners to align capabilities with industry needs",
        "Serve as technical champion for advanced packaging technologies",
        "Develop and execute program plans covering scope, schedules, risk mitigation, and resource allocation",
        "Create technical documentation and collateral to support customer design teams",
        "Monitor advanced packaging market trends and competitive developments",
        "Champion accountability and transparency across product workstreams"
      ],
      "skills": [
        "Advanced packaging technologies",
        "Microsystems integration",
        "Semiconductor packaging",
        "Product management",
        "Program management",
        "Cross-functional collaboration",
        "Technical communication",
        "Market analysis",
        "Customer engagement",
        "Strategic partnership development"
      ],
      "tools": [
        "Electronic Design Automation (EDA) flows",
        "Product Requirements Documents (PRDs)"
      ],
      "educationLevel": 3,
      "educationKeywords": [
        "Electrical Engineering",
        "Computer Engineering",
        "Microelectronics",
        "Semiconductor packaging"
      ],
      "certifications": [],
      "languages": [],
      "yearsRelevant": 5
    },
    "secondarySignals": {
      "tasks": [
        "Manage dependencies and proactively resolve roadblocks",
        "Represent TIE in technical discussions and industry forums",
        "Support customer design teams with integration guidelines and reference designs"
      ],
      "skills": [
        "Modeling, simulation, and reliability across electrical, thermal, and mechanical"
      ],
      "tools": [
        "PDK/ADK creation and integration with major EDA vendor flows"
      ],
      "educationLevel": 4,
      "educationKeywords": [
        "Mechanical Engineering",
        "Materials Science"
      ],
      "certifications": [],
      "languages": [],
      "yearsRelevant": 10
    },
    "practical": {
      "locations": [
        "Austin, TX"
      ],
      "locationProvenance": "stated",
      "countries": [
        "US"
      ],
      "workModes": [
        "unknown"
      ],
      "workModeProvenance": "defaulted",
      "employmentTypes": [
        "full_time"
      ],
      "compensation": null
    },
    "dataCompleteness": "high"
  },
  "indexing": {
    "function": "business_administration_professionals",
    "functionConfidence": "high",
    "roleFamily": "m122_sales_marketing_development_managers",
    "roleFamilyConfidence": "medium",
    "countryCode": "US",
    "countryCodeConfidence": "high",
    "locationBucket": "unknown",
    "locationBucketConfidence": "unknown",
    "workMode": "unknown",
    "workModeConfidence": "unknown",
    "employmentType": "full_time",
    "employmentTypeConfidence": "high",
    "isAgency": "direct",
    "salaryMax": null,
    "industryGroup": "i68_higher_education",
    "industryGroupConfidence": "high",
    "educationRequired": 3,
    "educationRequiredConfidence": "high"
  },
  "display": {
    "title": "Senior or Principal Product Manager, Texas Institute for Electronics",
    "company": {
      "name": "The University of Texas at Austin"
    },
    "locationDisplay": "Austin, TX",
    "applicationUrl": null
  },
  "roleFamilyEsco": "m122_sales_marketing_development_managers",
  "requirementsEssentiality": {
    "items": [
      {
        "text": "BS in Electrical Engineering, Computer Engineering, or a related technical discipline",
        "category": "education",
        "essentiality": "compulsory",
        "triggerPhrase": "Required Qualifications",
        "confidence": "high"
      },
      {
        "text": "5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product",
        "category": "skill",
        "essentiality": "compulsory",
        "triggerPhrase": "Required Qualifications",
        "confidence": "high"
      },
      {
        "text": "10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product",
        "category": "skill",
        "essentiality": "compulsory",
        "triggerPhrase": "Required Qualifications",
        "confidence": "high"
      },
      {
        "text": "Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging,",
        "category": "skill",
        "essentiality": "compulsory",
        "triggerPhrase": "Required Qualifications",
        "confidence": "high"
      },
      {
        "text": "Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK",
        "category": "skill",
        "essentiality": "compulsory",
        "triggerPhrase": "Required Qualifications",
        "confidence": "high"
      },
      {
        "text": "Austin, Texas is preferred for close collaboration with our engineering teams and partners",
        "category": "skill",
        "essentiality": "preferred",
        "triggerPhrase": "Location. Austin, Texas is preferred",
        "confidence": "high"
      },
      {
        "text": "MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field",
        "category": "education",
        "essentiality": "preferred",
        "triggerPhrase": "Preferred Qualifications",
        "confidence": "high"
      },
      {
        "text": "Proven program management chops – you can demonstrate end-to-end ownership of complex programs involving multiple",
        "category": "skill",
        "essentiality": "preferred",
        "triggerPhrase": "Preferred Qualifications",
        "confidence": "high"
      },
      {
        "text": "Experience working directly with subcontractors, vendors, or external partners to define clear expectations, manage",
        "category": "skill",
        "essentiality": "preferred",
        "triggerPhrase": "Preferred Qualifications",
        "confidence": "high"
      },
      {
        "text": "Prior experience at a leading semiconductor foundry or packaging house is a strong plus",
        "category": "skill",
        "essentiality": "preferred",
        "triggerPhrase": "Preferred Qualifications",
        "confidence": "high"
      }
    ]
  }
}